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WESEMIBAY 2025 Focuses on Precision Manufacturing – Hardware Components Become Key To Dicing Machine Stability
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WESEMIBAY 2025 Focuses on Precision Manufacturing – Hardware Components Become Key To Dicing Machine Stability

Views: 0     Author: Site Editor     Publish Time: 2025-10-16      Origin: Site

The 2025 WESEMIBAY scaled unprecedented heights, covering over 60,000 square meters and gathering more than 600 semiconductor companies from over 20 countries. Industry giants such as Applied Materials (USA), Disco (Japan), and Merck (Germany) made their appearance, while leading Chinese enterprises including SiCarrier,NAURA, and CR Microalso showcased their innovations.

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The exhibits span the full semiconductor industry chain, covering wafer fabrication, advanced packaging, compound semiconductors, and chip design. As a key device in the back-end of semiconductor manufacturing, dicing machines occupy an important position at the exhibition.



A dicing machine is one of the core devices in the semiconductor packaging and testing process. It separates individual chips from a wafer using a high-speed rotating diamond blade. Such precision equipment demands extremely high stability in both internal structure and external protection. Even minimal vibration or displacement can affect cutting quality and reduce product yield.



In these invisible details, industrial hardware components play a vital role:


Leveling feet: provide horizontal adjustment and vibration-damping support, keeping the machine balanced even at high speeds


Handle: ensures smooth opening and closing of the machine, improving maintenance and inspection efficiency


Magnet catch: keeps doors firmly closed, preventing micro-vibrations and external dust from affecting machine operation


Though seemingly small, these components bear the responsibility of stability, precision, and reliability in every step of semiconductor manufacturing.


ShangKun is committed to providing high-reliability precision structural components for semiconductor manufacturing equipment:


GT28 Heavy-Duty Anti-Vibration Leveling Feet


1.Equipped with rubber pads at the base to effectively prevent slipping and dampen vibration, reducing interference caused by vibrations


2.High load capacity, available in 300–1500KG, meeting the needs of various equipment

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SK4-038S Stainless Steel Folding Handle


1.90° foldable handle saves operational space and facilitates opening and closing of machine doors or compartments, enhancing maintenance and operational efficiency


2.Made of stainless steel, corrosion-resistant and durable, ensuring the reliability of the dicing machine in daily use and maintenance

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K5-038-8 Dust-Proof Magnet Catch


1.POM-encased magnet suppresses dust entry, protecting the internal environment of the dicing machine and reducing interference with wafer cutting precision


2.5.1Kgf holding force ensures machine doors remain firmly closed, preventing vibration from affecting machine operation and guaranteeing stable, efficient cutting


3.Two mounting surfaces to meet different installation requirements

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Behind every precise cut in semiconductor manufacturing, ShangKun hardware provides stable and reliable components, safeguarding dicing machines and ensuring that each wafer reflects outstanding quality.


 Address: No.39, Shichang Road, Zhuanyao Industrial Area, Dongcheng District, Dongguan, Guangdong, China.
 Tel : +86-769-27235720
 Email: mandy@kunlong.net

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